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电气工程与自动化学院研究生导师介绍-杜明星
2021-10-15 09:09   审核人:

姓名

杜明星

学历学位

博士

性别

导师类型

硕导

  职称
  教授

所属学院

电气工程与自动化学院

Email

dumx@tjut.edu.cn

学术兼职


招生专业

080800电气工程(学硕)

085801电气工程(专业学位)、085400电子信息(控制工程)

研究方向

电力电子装置控制策略、可靠性、电磁兼容。

主持/参与的部分项目:

[1]国家重点研发计划:智能电动汽车电子电气架构研发

[2]天津市自然科学基金:计及老化和多热源耦合的功率器件热可靠性关键问题研究

[3]天津市技术创新引导专项:基于数字孪生技术的电机控制器及其功率器件的老化监测方法

[4]国家重点实验室开放基金:计及EMI及热耦合影响的功率器件可靠性研究

[5]企业委托课题:1000V超宽输入高压直流变换器

[6]企业委托课题:新能源汽车关键部件的EMC技术研究

[7]企业委托课题:物联网云技术与状态监测融合机制在电梯制动器及门系统安全运行方面的应用

代表性学术成果:

[1] Jinlei Xin,Mingxing Du, Ziwei Ouyang, Kexin Wei. Online Monitoring for Threshold Voltage of SiC MOSFET Considering the Coupling Impact on BTI and Junction Temperature[J].IEEE Transactions on Electron Devices. 2021, 68(4):1772 - 1777.

[2] Chengpeng Chu, Chao Dong,Mingxing Du, Xuesong Zhou, Ziwei Ouyang. Aging Monitoring of Bond Wires Based on Differential Mode Conducted Interference Spectrum for IGBT Module[J].IEEE Transactions on Electromagnetic Compatibility. 2021, PP(99):1-10..

[3]Mingxing Du, Jinlei Xin, Hongbin Wang, Ziwei Ouyang. Aging Diagnosis of Bond Wire Using On-State Drain-Source Voltage Separation for SiC MOSFET[J].IEEE Transactions on Device and Materials Reliability. 2021, 21(1):41-47.

[4]Wenbai Wang,Mingxing Du, Kexin Wei. Rapid Torque Rising of PMSM by Directly Chasing Rotating Flux Linkage Vector[J].IEEE Journal of Emerging and Selected Topics in Power Electronics. 2021, Early Access Article.

[5]Mingxing Du, Jinlei Xin, Hongbin Wang, Ziwei Ouyang and Kexin Wei. Estimating Junction Temperature of SiC MOSFET Using Its Drain Current During Turnon Transient[J].IEEE Transactions on Electron Devices. 2020, 67(5): 1911-1918.

[6] Lei Jing,Mingxing Du, Kexin Wei, William Gerard Hurley. An Improved Behavior Model for IGBT Modules Driven by Datasheet and Measurement[J].IEEE Transactions on Electron Devices, 2020, 67(1): 230-236.

[7]Mingxing Du, Qiuya Guo, Hongbin Wang, Ziwei Ouyang, Kexin Wei. An Improved Cauer Model of IGBT Module:Inclusive Void Fraction in Solder Layer[J].IEEE Transactions on Components, Packaging and Manufacturing Technology. 2020, 10(8): 1401 - 1410.

[8]Mingxing Du, Yuxiao Zhang, Hongbin Wang, Ye Tian, Ziwei Ouyang, and Kexin Wei. An Improved Calculation Method for Static Capacitance in Inductor Windings [J].Progress In Electromagnetics Research C, 2020,Vol.104:25-36.

[9]Mingxing Du, Yang Li, Hongbin Wang, Ziwei Ouyang, and Kexin Wei. An Online Measurement Method for Noise-Source Impedance of Electrical Equipment[J].Progress In Electromagnetics Research C, 2020,Vol.100:95-103.

[10] Chao Dong, Han Chen,Mingxing Du. Analysis of the Effect of Temperature on the Wideband Characteristics of EMI Filters [J].Progress In Electromagnetics Research Letters,2020,Vol. 91, 67-75.

[11] Jiangyong Zhang,Mingxing Du, Lei Jing, Kexin Wei, William Gerard Hurley. IGBT Junction Temperature Measurements: Inclusive of Dynamic Thermal Parameters[J].IEEE Transactions on Device and Materials Reliability, 2019, 19(2): 333-340.

[12]Mingxing Du, Qingyi Kong, Ziwei Ouyang, Kexin Wei, William G. Hurley. Strategy for Diagnosing the Aging of an IGBT Module by ON-State Voltage Separation [J].IEEE Transactions on Electron Devices,2019, 66(11): 4858-4864.

[13] Lei Jing,Mingxing Du, Kexin Wei, William Gerard Hurley. A Health Monitoring Method for Bond Wires in IGBT Modules Based on Voltage Ringing Characteristics[J].IEEE Transactions on Electron Devices, 2019, 66(9): 3953-3960

[14]Mingxing Du, Yu Tang, Mengchao Gao, Ziwei Ouyang, Kexin Wei, William Gerard Hurley. Online Estimation of the Junction Temperature Based on the Gate Pre-Threshold Voltage in High-Power IGBT Modules[J].IEEE Transactions on Device and Materials Reliability, 2019, 19(3): 501-508.

[15] Zhen Hu,Mingxing Du, Kexin Wei, William Gerard Hurley. An Adaptive Thermal Equivalent Circuit Model for Estimating the Junction Temperature of IGBT[J].IEEE Journal of Emerging and Selected Topics in Power Electronics, 2019, 7 (1):392-403.

[16]Du Mingxing, Zhang Xing, Wei Kexin, Hurley William Gerard. An alternative method for conducted immunity tests using multiple CDNs[J].IEEE Electromagnetic Compatibility Magazine,2019, 8(1):54-58.

[17]Mingxing Du, Qiuya Guo, Ziwei Ouyang, Kexin Wei, William Gerard Hurley. Effect of solder layer crack on the thermal reliability of Insulated Gate Bipolar Transistors[J].Case Studies in Thermal Engineering, 2019, 14:100492.

[18]Du Mingxing, Zhang Xing, Wei Kexin, Hurley William Gerard. An alternative method for conducting immunity tests in the industrial environment[J].IEEE Electromagnetic Compatibility Magazine,2018, 7(3):46-50.

[19] Zhen Hu,Mingxing Du, Kexin Wei. Online Calculation of the Increase in Thermal Resistance Caused by Solder Fatigue for IGBT Modules[J].IEEE Transactions on Device and Materials Reliability, 2017, 17(4):785-794.

[20]杜明星,杭州,丁一夫,魏克新.磁环线圈匝数谐振频率测量及在抑制传导干扰中的应用[J].电源学报,2017,15(03):50-54.

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